发明名称 COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a component mounting device that can shorten the moving distance of a placement head for reducing the cycle time, and has superior placement position accuracy. SOLUTION: A part-supplying part 3 that is set by combining a pallet (component supplying tool) 3a with a vibration feeder 30, and a component supplying part 4 where a printed circuit board (an object to be mounted) 4a is set are allowed to reciprocate in X-axis directions that are independent and in parallel with each other. Also, a placement head 6 having a suction nozzle (part retention mechanism) 5 that is allowed to reciprocate in the Z-axis direction is allowed to linearly reciprocate in the Y-axis direction orthogonally crossing the X-axis direction. Furthermore, a part image pickup camera (part image pickup means) 7 for picking up the image of an electronic component that is retained by the suction nozzle 5 is provided.
申请公布号 JP2001267798(A) 申请公布日期 2001.09.28
申请号 JP20000075828 申请日期 2000.03.17
申请人 MURATA MFG CO LTD 发明人 TAMURA KOUTA;ISHIBE TOSHIYUKI;NASHIMA HOZUMI;NISHI TERUKI;KAJIWARA MASATOSHI
分类号 H05K13/04;H05K3/30;H05K13/00;H05K13/08 主分类号 H05K13/04
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