| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure and a method for dissipating heat efficiently from a heat generating component by bringing a heat dissipating means into contact surely with the heat generating component while reducing the size of a first substrate, and an electronic apparatus having that heat dissipating structure. SOLUTION: The heat dissipating structure comprises a first substrate 1 mounting a heat generating component 6, a second substrate 2 mounting means 5 for dissipating heat from a heat generating component 6, and a support 3 for supporting the first and second substrate 1, 2.
|
