| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing printed wiring boards, which needs no special facility such as large-scale facility or facility for waste liquid processing and by which printed wiring boards exhibiting necessary mounting properties can be obtained, and to provide such printed wiring boards. SOLUTION: Resin sheets 13 of thermosetting resin are placed on both sides of a core substrate 14 and sheets of copper foil 12 are placed on the outside of the resin sheets 13. Two SUS boards 15 are sandwiched between an upper mold 16 and a lower mold 17 and are pressed. When the SUS boards 15 are pressed by the upper mold 16, protrusions 11a of a mold 11 are engaged in the copper foil 12, and the engaged copper foil 12 is embedded in the resin sheet 13 under the copper foil 12. The copper foil 12 is bonded to the core substrate 14 while being embedded in the resin sheet 13.
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