| 摘要 |
A drive circuit 12 is mounted on a metal substrate 50, a control circuit 13 is mounted on an insulating substrate 70, and a large current circuit component such as an electrolytic condenser 18 is mounted on a baseboard 30 integrated with a metallic circuit conductor constituent member 31 by insert molding, in which the metal substrate 50 and the insulating substrate 70 are laminated on the baseboard 30.
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