| 摘要 |
PURPOSE: To provide a method for forming a metal wiring by which dishing or erosion can be suppressed, variance in wiring resistance be eliminated, and highly reliable embedded wiring be formed. CONSTITUTION: This method for forming a metal wiring includes a step for forming recessed parts on an insulation film formed on a board, a step for forming a barrier metallic film on the insulation film, a step for forming a wiring metal film entirely so as to embed the recessed parts, and a step to polish the surface of the board by the chemical and mechanical and polishing method. In the polishing step, a first step where the board is polished so that the wiring metallic film is left partly on the surface other than the recessed parts, and a second polishing step where the board is polished by using a slurry for polishing, in which the polishing speed ratio of wiring metal to barrier metal is more than 1 and 3 or less until the surface of the insulation film other than the recessed parts is almost entirely exposed, are executed. |
