| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling structure of multichip module that is small in size and excellent in cooling performance. SOLUTION: This solution can promote the cooling effect of the electronic element chip 24 by means of cooling the electronic element chip 24 through both the path which reaches to the cooling medium via the insulating board 22 and the heat sink 40 and the path which reaches to the cooling medium via the insulating board 22 and the heat sink 40 by way of the electronic element chip 26, which is soaked with the electronic element chip 24 by the soaking board 30, and the electrode, through connecting the electronic element chip 24 with large heat-generation value, the electronic component chip 26 with small heat-generation value and the electrode through the soaking board 30 formed by the conductive material with high heat conductivity, and through setting the heat radiation board 40 for cooling in use of the cooling medium under the insulating board 22 mounted the electronic element chips 24 and 26. In addition, the soaking board 30 is not necessary for wire bonding, as the soaking board 30 is on use combined with the material supplying the electric power from the electrode to the electronic element chip 24 and 26. |
