| 摘要 |
The semiconductor device has two sets of semiconductor units 13, having a plurality of semiconductor pellets 11 arranged and connected in parallel on the same plane, which are connected in series with a common electrode plate 14 intervened between the semiconductor units 13. An anode plate 15 and a cathode plate 16 are arranged in parallel on both sides of the semiconductor units 13. These electrode plates are pushed against the opposed main faces of the semiconductor pellets 11 by pushing force of coned disc springs 17. A press-connecting screw member consisting of a through bolt 21 and a nut 22 is set through the center of the semiconductor units and the like. A pushing force is uniformly applied to respective parts of the electrode plates without being dispersed, and the electrode plates are securely pushed against the respective semiconductor pellets 11. Thus, the semiconductor pellets 11 and the electrode plates and the like are securely connected by press connecting, thereby preventing a fatigue failure or breakage due to a difference in thermal expansion coefficient from being caused even if heating and cooling are repeated while the semiconductor device is operating.
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