发明名称 |
POWER MODULE |
摘要 |
PROBLEM TO BE SOLVED: To provide a power module which can easily correspond to the high functioning of a control circuit board. SOLUTION: A case 14 where a control circuit board 15 is arranged inside is disposed on a case 6. A circuit pattern which is not illustrated is formed on the upper face of the control circuit board 15. A chip 18 for controlling power elements 2 is mounted through solder 19. A connector 20 for installing the control circuit board, which has a connector terminal 20a that is electrically connected to the chip 18, is formed on the upper face of the control circuit board 15. A connector 16 having a connector terminal 16a that is electrically connected to the chip 18 is formed on the base of the control circuit board 15. The connector 16 is inserted into a connector 13 and the connector terminal 16a is mutually brought into contact with a connector terminal 13a. |
申请公布号 |
JP2001237368(A) |
申请公布日期 |
2001.08.31 |
申请号 |
JP20000042681 |
申请日期 |
2000.02.21 |
申请人 |
MITSUBISHI ELECTRIC CORP;RYODEN SEMICONDUCTOR SYST ENG CORP |
发明人 |
YOSHIDA TAKANOBU;KOGA MASUO;KIMOTO NOBUYOSHI;YOSHIMATSU NAOKI |
分类号 |
H01L23/32;H01L25/00;H01L25/07;H01L25/18;(IPC1-7):H01L25/07 |
主分类号 |
H01L23/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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