| 摘要 |
PROBLEM TO BE SOLVED: To provide an FC BGA substrate which has a bump pad having an excellent connecting property by irradiating a carbon dioxide gas laser onto the bump pad of a solder resist layer coated on the entire surface of the substrate for surface treatment for solder connection (in particular, pre-flux treatment), and also to provide a method for manufacturing the substrate. SOLUTION: In the FC BGA substrate which has a bump pad, a carbon dioxide gas laser is irradiated onto the bump pad of a solder resist layer coated on the entire surface of the substrate for surface treatment for solder connection. As a result, the pad can have an excellent solderability or solder connectability. |
