发明名称 Soldermask opening to prevent delamination
摘要 A multilayer circuit board includes a base layer, a conductive layer and a soldermask. The soldermask layer has two sets of openings. One of the openings are vent openings, that expose the base layer to provide ventilation so that gases may escape during processing. The second openings expose selective regions of a conductor layer. The multi-layer circuit board provides for less occurrences of delamination.
申请公布号 US2001017768(A1) 申请公布日期 2001.08.30
申请号 US20010854073 申请日期 2001.05.11
申请人 发明人 RUMSEY BRAD D.
分类号 H05K3/34;(IPC1-7):H05K1/03 主分类号 H05K3/34
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