发明名称 METHOD AND DEVICE FOR SOLDERING WORKING
摘要 PROBLEM TO BE SOLVED: To satisfactorily perform the soldering of an object to be worked by preventing an insulating coating from being burnt at the time of soldering and preventing molten solder from dropping from the soldered part of the object. SOLUTION: A device is equipped with a heat source 13 supplying heat energy, a solder supply device 11 supplying solder and a jig 20 holding the object 32 to be worked. A groove Q constituted so that it can be soldered to the object 32 by heat energy and solder and in which the soldered part of the object 32 is housed, is provided on the jig 20, and the heat source 13 and the solder supply device 11 are arranged on the opposite side of this jig 20. The jig 20 before soldering is maintained at a specific temperature by an auxiliary heat source 21 provided on the jig 20 besides the heat source 13. After completing soldering, by supplying air to a path 23 provided in the jig 20, the object 32 and the jig 20 are cooled. Consequently, by holding the object 32 housed in the groove Q and by supplying heat energy and solder to the object 32, satisfactory soldering is performed.
申请公布号 JP2001232459(A) 申请公布日期 2001.08.28
申请号 JP20000046962 申请日期 2000.02.24
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TAKAGI SEIJI
分类号 B23K26/00;B23K1/00;B23K3/04;B23K31/02;B23K101/38 主分类号 B23K26/00
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