| 摘要 |
PROBLEM TO BE SOLVED: To improve a workability upon fixingly assembling a semiconductor to a heat sink. SOLUTION: In the structure for mounting of a semiconductor 9 to a heat sink 1, a slit 4 is made in the heat sink 1 into a flower pedal shape to form an annular projection 2, the outer diameter of the projection 2 is set smaller that the inner diameter of mounting hole 11 of the semiconductor 9, the inner diameter of the projection 2 is set smaller than the maximum diameter of a leg part 6 of a fixing pin inserted in the semiconductor 9, the outer periphery of the projection 2 is fitted into the mounting hole 11, and a fixing pin 5 of the semiconductor 9 is fixedly inserted in the inner periphery thereof.
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