发明名称 CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a circuit board in which the conductive loss is low when being mounted on an electric or electronic device for high-frequency current and troubles in the electric or electronic device can be prevented. SOLUTION: A circuit board 1 is formed by laminating a layer 2 made of copper foil and a copper-planted layer 3 on an insulating board 5 made of polytetrafluoroethylene so that a predetermined circuit is formed, and laminating a tin-planted layer 4 on the layers made of copper.
申请公布号 JP2001223451(A) 申请公布日期 2001.08.17
申请号 JP20000030922 申请日期 2000.02.08
申请人 MASPRO DENKOH CORP 发明人 KUNO TAKEHITO
分类号 H05K1/09;H05K3/24;(IPC1-7):H05K1/09 主分类号 H05K1/09
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