THICK-FILM ETCH-BACK PROCESS FOR USE IN MANUFACTURING FINE-LINE HYBRID CIRCUITS

摘要

A method for making thick-film conductor line patterns having conductor linewidths and spacings which are each less than about 5 mils. The method is especially useful in manufacturing fine-line hybrid circuits. The method involves forming a conductor line circuit pattern of thick-film material on a principle surface of a substrate. The principle surface of the substrate is masked so that selected portions of the conductor line circuit pattern are exposed. The exposed portions of the pattern are then removed from the substrate to reduce the conductor linewidths and spacings of the pattern to less than about 5 mils.