发明名称 LASER BEAM PROCESSING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser beam processing method in which a protective sheet is not peeled out from the surface of a processed work during processes for making a piercing hole, and for cutting followed thereafter. SOLUTION: While an assisting gas is blowing onto the processed work, a laser beam L is first irradiated to a processed work 3 so that an encircled portion surrounding a piercing point P of a protective sheet 5 is only cut. Next, the laser beam L is irradiated to the piercing point P so that a piercing hole 3a is made in a basic material 4. Then, the laser beam L is irradiated to the processed work 3 so that a through hole in an up and down direction to pass through the assisting gas is made at the place of the piercing hole 3a.</p>
申请公布号 JP2001212681(A) 申请公布日期 2001.08.07
申请号 JP20000027057 申请日期 2000.02.04
申请人 SHIBUYA KOGYO CO LTD 发明人 NAKAMURA SEIICHI
分类号 B23K26/00;B23K26/14;B23K26/18;B23K26/38;(IPC1-7):B23K26/00 主分类号 B23K26/00
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