| 摘要 |
PROBLEM TO BE SOLVED: To shorten extremely long test time of a test in wafer stage using a prober, where individual semiconductor chips are tested sequentially in conventional IC inspection, in which inspection is made both in a wafer stage and in a packaged stage. SOLUTION: A test without using a tester can be made, by constructing test circuits on a probe card or on a wafer in which semiconductor chips to be tested are formed and by electrically connecting the test circuits respectively to the semiconductor chips to be tested for performing the test. In addition, by conducting test in wafer stage in an aging apparatus, it is possible to simplify or omit the test, after being packaged.
|
