SEMICONDUCTOR DEVICE HAVING SIDE PAD OF DIMPLE TYPE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A semiconductor device having a side pad of dimple type and a manufacturing method thereof are provided to realize a cubic side pad by expanding a region where bonding pads are formed to other portions than an active surface. CONSTITUTION: A semiconductor device(50) is formed on a side surface(66) in contrast to a conventional art in which the semiconductor device is formed on an upper surface of an active surface(60). The active surface(60) has an outer part(64) which surrounds an integrated circuit part(62). Integrated circuits are formed on the integrated circuit part(62). A device body(70) includes the integrated circuit part(62) and the active surface(60). Side pads(80) are formed on a side surface(66) connected to the outer part. Bonding pads includes the side pads(80). A metal interconnection(72) crosses the outer part(64) and the integrated circuit part(62). The side pads(80) is electrically connected to the integrated circuits through the metal interconnection. The outer part of the active surface is a region remaining after a scribe line is cut on the basis of a wafer.