| 摘要 |
PROBLEM TO BE SOLVED: To provide a producing method for electronic circuit block, with which inexpensive production is enabled by molding a resin only at a desired spot on a substrate. SOLUTION: A substrate 4 is located, while packaging an electronic component 3 inside a metal die 2 having a space 1 for resin injection. Next, a resin 5 is injected into the space 1 for resin injection and after the resin 5 is solidified or cured, an electronic circuit block A molding and forming the resin 5 on the substrate 4 is taken out of the metal die 2. By injecting and molding the resin 5 in the space 1 for resin injection, the resin 5 can be molded only at a spot requiring insulation or moisture proofing on the substrate 4.
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