| 摘要 |
The invention relates to a coil (20) and a coil system to be integrated in a microelectronic circuit (10) and to a corresponding microelectronic circuit (10). According to the invention, the coil (20) is placed inside an oxide layer (13) of a chip (11), whereby the oxide layer (13) is placed on the substrate surface (14) of a substrate (12). The coil (20) comprises one or more windings (21), whereby the winding(s) (21) is/are formed by at least segments of two conductor tracks (22, 23), which are each provided in spatially separated metallization levels (24, 25), and by via-contacts (40) which connect these conductor track(s) (22) and/or conductor track segments (23). In order to be able to produce high-quality coils (20), a coil (20) is produced with the largest possible coil cross-section (27), whereby a standard metallization, especially a standard metallization using copper, can, however, be used for producing the coil (20). To this end, the via contacts (40) are formed from a stack (41) of two or more via elements (42) arranged one above the other. Parts (43) of the metallization levels can be located between the via elements (42).
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