RESIN PASTE FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE SAME,申请号JP20000017002-传众专利搜索

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发明名称	RESIN PASTE FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE SAME
摘要	PROBLEM TO BE SOLVED: To obtain a resin paste for semiconductors which, even when cured in an open area or in-line, exhibits a strong adhesive strength under heating and an excellent moisture resistance. SOLUTION: This resin paste comprises an epoxy resin, a phenolic curing agent, a metal complex, and an inorganic filler, the epoxy resin comprising a liquid epoxy resin and an alicyclic epoxy resin. A semiconductor device is prepared by using the resin paste.
申请公布号	JP2001207022(A)	申请公布日期	2001.07.31
申请号	JP20000017002	申请日期	2000.01.26
申请人	SUMITOMO BAKELITE CO LTD	发明人	NAITO MANABU
分类号	H01L21/52;C08G59/22;C08L63/00;(IPC1-7):C08L63/00	主分类号	H01L21/52
代理机构		代理人
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地址

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