发明名称 MOUNTING STRUCTURE OF BARE CHIP OF SWITCHING ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a mounting structure with which low on-resistance is realized and a protective circuit board is miniaturized by exploding a mounting structure of a power MOSFET, since miniaturization and weight reduction of a portable terminal, and long life of available time of a built-in battery are required more intensely. SOLUTION: In the short side direction of a long and narrow insulating substrate 31, a sticking electrode 35 having a width almost equal to the length of the short side is provided, and one connection electrode 38 and the other connection electrode 39 are placed on both sides of a long side direction of the sticking electrode 35. Bare chips 33 and 34 of a power MOSFET are fixed onto the sticking electrode 35, and a bonding fine line 40 connected to a gate electrode 36 is connected to one connection electrode 38, and one end of a plate-like connecting board 44, the other end of which is connected to almost the entire surface of a source electrode 37, is connected to the other connection electrode 39. Thereby a mounting structure of the bare chip of a switching element which is very small and has low on-resistance is provided.
申请公布号 JP2001203220(A) 申请公布日期 2001.07.27
申请号 JP20000010981 申请日期 2000.01.19
申请人 SANYO ELECTRIC CO LTD 发明人 YANAGIDA TAKAHITO;KOBAYASHI HIROAKI;FUKUDA HIROKAZU;ETO HIROKI
分类号 H01L21/50;H01L25/07;H01L25/18 主分类号 H01L21/50
代理机构 代理人
主权项
地址
您可能感兴趣的专利