发明名称 BONDING DEVICE AND METHOD
摘要 <p>PROBLEM TO BE SOLVED: To eliminate the need for an exclusive camera for calibrating offset when using a reference member for calibrating offset. SOLUTION: An axis center 4a of a tool 4 is brought closer to a reference member 30, laser diodes 16 and 17 are sequentially turned on for picking up the images of the reference member 30 and the tool 4 in X and Y directions by a camera 7 for detecting positions, and the amount of deviation of the tool 4 and the reference member 30 is measured. The camera 7 for detecting positions is brought closer to the reference member 30 to measure the amount of deviation between a light axis 7a of the camera 7 for detecting positions and the reference member 30 using the camera 7 for detecting positions. Based on the measurement values and the amount of travel, an accurate amount of offset is obtained. The image light of the tool 4 and the reference member 30 is guided to the camera 7 for detecting positions by prisms 13, 14, and 18, and a half mirror 15, thus eliminating the need for an exclusive camera for detecting the amount of deviation between the tool 4 and the reference member 30.</p>
申请公布号 JP2001203234(A) 申请公布日期 2001.07.27
申请号 JP20000012738 申请日期 2000.01.21
申请人 SHINKAWA LTD 发明人 HAYATA SHIGERU;KYOMASU RYUICHI;ENOKIDO SATOSHI;SASANO TOSHIAKI
分类号 H01L21/60;B23K20/00;H01L21/00;H01L21/52;H01L21/607;(IPC1-7):H01L21/60 主分类号 H01L21/60
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