| 摘要 |
PROBLEM TO BE SOLVED: To control void when manufacturing circuit wiring conductor of ceramic circuit board. SOLUTION: A thick film paste whose main component is Cu when manufacturing wiring conductor of ceramic circuit board includes, with respect to 100 weight part of copper, metal oxide, metal carbide, metal nitride or metal boride which are 0.1-3μm in their particle diameters and do not make solid-solution with copper, and whose melting temperature are more than their sintering temperatures in the ratio of 0.1-0.5 weight part.
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