发明名称 Thermal dissipation and EMI shielding structure for notebook computers
摘要 A notebook computer (90) has a lower housing (120) with a keyboard (42) and an upper housing (100) with a display (114), a central processing unit (CPU) (110), and a conductive plate (118). The CPU (110) is attached directly to the conductive plate (118) to achieve maximum heat transfer. The conductive plate (118) is exposed to the air outside the notebook computer (90) through air vents (122) in the upper housing (100). Other heat generating elements in the upper housing are directly attached to thermally isolated islands (150) within the conductive plate (118) to allow each element to maintain a separate operating temperature while still conducting heat out of the notebook computer (90) to the outside air. Additionally, the conductive plate (118) is used as part of an electromagnetic interference enclosure to reduce unwanted radiation from leaving the notebook (90). <IMAGE>
申请公布号 EP0910005(A3) 申请公布日期 2001.07.18
申请号 EP19980308374 申请日期 1998.10.14
申请人 HEWLETT-PACKARD COMPANY 发明人 JONDROW, TIMOTHY J.
分类号 G06F1/16;G06F1/18;G06F1/20;H01L23/36 主分类号 G06F1/16
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