SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

摘要

PURPOSE: To provide a laminated multi-chip type semiconductor device without necessity for considering the size of a semiconductor chip or electrode position in the semiconductor chip, and provide a manufacturing method suitable for the semiconductor device. CONSTITUTION: A front face (face with junction electrode) of a first semiconductor chip 1a is bonded to a die pad part 2 of a lead frame with adhesive 4. A rear face of a second semiconductor chip 1b is bonded on the rear face of the first semiconductor chip 1a with adhesive 5. At the same time, a surface electrode of the first semiconductor chip 1a is joined electrically to an inner lead 3 of the lead frame with a bonding wire 6a. A surface electrode of the second semiconductor chip 1b and the inner lead 3 of the lead frame are joined electrically with a bonding wire.