SEMICONDUCTOR CHIP PACKAGE AND LEAD FRAME USED FOR THE SAME

摘要

PURPOSE: A semiconductor chip package and a lead frame used for the same are provided to perform easily a soldering process by increasing the number of lead without reducing an outer lead interval or a lead width. CONSTITUTION: A package body(124) is formed with an outline including the first outline(126a) and the second outline(126b). A lead is formed with the first lead formed along the first outline(126a) and second lead formed along the second outline(126b). A virtual rectangle is formed by the first outline(126a) and its extending line. A predetermined angle is formed within the virtual rectangle by the second outline(126b) and the first outline(126a). A total length of the first and the second outlines(126a,126b) is larger than a total length around the virtual rectangle.