| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus that can rapidly lower the temperature of a heating plate while maintaining the temperature of the surface on which the heating plate is placed almost uniformly over the entire surface. SOLUTION: The heat treatment apparatus (CHP) that heat-treats a substrate W at a given temperature comprises a heating plate 51 that brings the substrate W close to or places it on the surface to heat-treat it, and a cooling gas supply unit 74, 78 supplying a cooling gas to the rear of the heating plate 51 to lower the temperature of the heating plate. The cooling gas supply unit 74, 78 supplies a gas so that the gas flows from the part where the cooling rate is low to the part where the cooling rate is high.
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