发明名称 SOI SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PURPOSE: To provide an SOI semiconductor device comprising built-in variable resistance element which can take a larger width in change of resistance value, namely a control electrode which can control electrical characteristics. CONSTITUTION: There is provided an SOI semiconductor device where a resistance body 4, which is completely insulated and separated with an insulation film 2a, is formed with a surface semiconductor layer of the SOI substrate laminating the embedded insulation film 2 and surface semiconductor layer and the resistance value of the resistance body 4 is set, depending on the impurity concentration included in the surface semiconductor layer and a size of the resistance body 4.
申请公布号 KR20010060296(A) 申请公布日期 2001.07.06
申请号 KR20000066751 申请日期 2000.11.10
申请人 SHARP CORPORATION 发明人 ALBERT O. ADAN
分类号 H01L27/04;H01L21/822;H01L27/08;H01L29/8605;(IPC1-7):H01L27/04 主分类号 H01L27/04
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