SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a method for manufacturing the same are provided to form a semiconductor package of new type by using an electro rheological fluid. CONSTITUTION: A bonding pad(500) is formed on a semiconductor chip(5). A contact pad(400) is formed on a circuit board(4). The bonding pad(500) of the semiconductor chip(5) is faced to the contact pad(400) of the circuit board(4). An electro rheological fluid(2) is formed between the semiconductor chip(5) and the circuit board(4). A fluid reception body(7) receives the electro rheological fluid(2). The fluid reception body(7) is adhered on an upper face of the circuit board(4). The electro rheological fluid(2) is inserted into the fluid reception body(7) through an opening hole(700). The semiconductor chip(5) is adhered on the fluid reception body(7). A solder ball(6) is adhered to a bottom face of the circuit board(4).