发明名称 |
Semiconductor device and manufacturing method |
摘要 |
A semiconductor device comprising: a tape substrate which supports a semiconductor chip, said chip having surface electrodes, said tape substrate being provided with a plurality of leads corresponding to the surface electrodes of the semiconductor chip and bonded thereto, and with dummy leads formed in vacant regions in corner portions of the tape substrate where the leads are not formed; conductive members for bonding the surface electrodes of the semiconductor chip to the leads of the tape substrate; and a plurality of external terminals arranged on an outside periphery of the semiconductor chip and mounted on the tape substrate.
|
申请公布号 |
US2001006251(A1) |
申请公布日期 |
2001.07.05 |
申请号 |
US20000741899 |
申请日期 |
2000.12.22 |
申请人 |
MIYAKI YOSHINORI;HAGIWARA YASUHISA;ICHIHARA SEIICHI;NAKAMURA HISAO;SUZUKI HIDENORI |
发明人 |
MIYAKI YOSHINORI;HAGIWARA YASUHISA;ICHIHARA SEIICHI;NAKAMURA HISAO;SUZUKI HIDENORI |
分类号 |
H01L23/12;H01L21/60;H01L23/495;H01L23/498;(IPC1-7):H01L23/40 |
主分类号 |
H01L23/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|