HEAT-RESISTANT NONWOVEN FABRIC, METHOD FOR PRODUCING THE SAME AND SUBSTRATE MATERIAL FOR PRINTED CIRCUIT BOARD COMPRISING HEAT-RESISTANT NONWOVEN FABRIC

摘要

PROBLEM TO BE SOLVED: To provide a heat-resistant nonwoven fabric that comprises 5-100 wt.% of a wholly aromatic polyamide fiber and 95-0 wt.% of an organic fiber having >=250 deg.C melting point or thermal decomposition point and has high mechanical strength and excellent resin-impregnating ability, a method for producing the same and a substrate for printed circuit boards comprising the same. SOLUTION: A wet-type nonwoven fabric comprising 5-100 wt.% of the wholly aromatic polyamide fiber and 95-0 wt.% of the organic fiber having >=250 deg.C melting point or thermal decomposition point and 1-50 wt.% of a water-soluble binder is subjected to the water-flow interlacing treatment whereby the water-soluble binder is eluted and these fibers are interlaced three-dimensionally to give the objective heat-resistant nonwoven fabric. A method for producing the heat- resistant nonwoven fabric and the substrate for printed circuit boards are also provided.