发明名称 |
HIGH BREAKDOWN VOLTAGE SEMICONDUCTOR DEVICE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a high breakdown voltage semiconductor device which enhances insulating performance at a plurality of electrode pads, having exposed surfaces for electric connection. SOLUTION: An insulating layer of phosphorus glass 7 and a silicon nitride film 8 at the side and the peripheral portion of the phosphorus glass and the electrode pads 1, 10. The sides of the phosphorus glass 7 and the silicon nitride film 8 are coated by an organic insulating layer 20, and the sides of the electrode pads 1, 10 are exposed.</p> |
申请公布号 |
JP2001176876(A) |
申请公布日期 |
2001.06.29 |
申请号 |
JP19990359274 |
申请日期 |
1999.12.17 |
申请人 |
MATSUSHITA ELECTRONICS INDUSTRY CORP |
发明人 |
NODA MASAAKI;KINOSHITA TAKASHI;TAKAHASHI NAOKI;IKUTA AKIHISA |
分类号 |
H01L23/52;H01L21/312;H01L21/3205;H01L21/60;H01L21/768;H01L23/522;(IPC1-7):H01L21/320 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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