发明名称 HIGH BREAKDOWN VOLTAGE SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a high breakdown voltage semiconductor device which enhances insulating performance at a plurality of electrode pads, having exposed surfaces for electric connection. SOLUTION: An insulating layer of phosphorus glass 7 and a silicon nitride film 8 at the side and the peripheral portion of the phosphorus glass and the electrode pads 1, 10. The sides of the phosphorus glass 7 and the silicon nitride film 8 are coated by an organic insulating layer 20, and the sides of the electrode pads 1, 10 are exposed.</p>
申请公布号 JP2001176876(A) 申请公布日期 2001.06.29
申请号 JP19990359274 申请日期 1999.12.17
申请人 MATSUSHITA ELECTRONICS INDUSTRY CORP 发明人 NODA MASAAKI;KINOSHITA TAKASHI;TAKAHASHI NAOKI;IKUTA AKIHISA
分类号 H01L23/52;H01L21/312;H01L21/3205;H01L21/60;H01L21/768;H01L23/522;(IPC1-7):H01L21/320 主分类号 H01L23/52
代理机构 代理人
主权项
地址