| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide the semiconductor device of structure where stress due to the difference of a thermal expansion coefficient between a semiconductor element and a circuit board and the mechanical deformation of the circuit board can securely be relieved and connection reliability between the semiconductor device and the circuit board is superior. SOLUTION: A semiconductor substrate 5 where the semiconductor element is formed, a pad electrode 8 which is formed on the main face of the semiconductor substrate, a protection resin layer 4 formed on the main face of the semiconductor substrate, a metallic body 6 passing through the protection resin layer, metallic wiring 7 connecting the metallic body and the pad electrode, and a connection electrode 2 which is installed on the surface of the protection resin layer by connecting it to the metallic body and is used for connection with the circuit board, are disposed. The connection electrode has structure including a part constituted of conductive resin 2a.</p> |
