| 摘要 |
The invention relates to a measuring device (1) for detecting the thickness of a layer (20) which is applied to a component (100). The thickness is detected in a touchless and nondestructive manner and irrespective of the material the layer (20) is made of. An electromagnetic radiation source (2) is provided which emits radiation in the infrared area. The radiation source (2) is embodied as a solid body laser and is connected to a sensor unit (8) by means of at least one optical waveguide (4). The layer (20) can be scanned with the infrared radiation using the sensor unit. The heat radiation which is emitted by the layer (20) is detected by means of a detector (5) which can be integrated into the sensor unit (8). The thickness of the layer (20) is detected in an evaluation unit (11) according to the measuring signals. Comparative values are stored in said evaluation unit. |
