| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size of a semiconductor chip and to satisfactorily hold the electric characteristic of an input/output protection device. SOLUTION: A main circuit 21 is formed in the center of the surface of a semiconductor chip 25, and multiple outer terminals 22 are formed on the semiconductor chip 25 so that they surround the main circuit 21. An element isolation region 23 is formed on the semiconductor chip 25 so that it surrounds the outer terminals 22, and the input/output protection device 26 relieving abnormal voltage is formed on a scribe region 24 on the semiconductor chip 25 so that it surrounds the element isolation region 23.
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