| 摘要 |
PROBLEM TO BE SOLVED: To reduce crosstalk between different layer wiring and improve wiring efficiency. SOLUTION: First and second layer wiring are formed on orthogonal grids 11, 12. Whenθ=arctan(na/mb) is established using first and second layer wiring pitches (a, b) and even number n, m exceeding 2, third and fourth layer wiring are formed on inclined grids 13, 14, so that they can incline in the positive and negativeθdirection against the first layer wiring, respectively. Third and fourth layer wiring pitches (c, d) are C=d=na×mb/ (na)2+(mb)2}1/2. All the intersections of the third and fourth wiring are located at the position where they overlap with the intersections of the orthogonal grids 11, 12. Fifth and sixth layer wiring are formed on coarse orthogonal grids 15, 16 that form a subset of the orthogonal grids 11, 12. Fifth and sixth layer wiring pitches (e, f) are e=na and f=mb, and all the intersections of the fifth and sixth wiring are located at the position where they overlap with the intersections of the inclined girds 13, 14.
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