| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which can provide a cured product excellent in flexibility, soldering-heat resistance, heat deterioration resistance, electroless gold plating resistance, and is developable by an organic solvent or a dilute alkali solution and suitable for a solder resist and an interlayer insulating layer. SOLUTION: The resin composition comprises a specific oligomer (A), obtained by reacting a specific polyimide precursor bearing a specific terminal acid anhydride group with a polyol compound (b) as an optional component and an ethylenically unsaturated group-containing polyhydroxy compound (c), and a diluent (B). |
