| 摘要 |
PURPOSE: A method for assembling a semiconductor chip is provided to reduce manufacturing cost and to simplify a manufacturing process, by forming a flip-chip structure without forming a bump between the semiconductor chip and a printed circuit board. CONSTITUTION: A semiconductor chip(100) having a plurality of bonding pads(112) along a side of an active surface is prepared. A printed circuit board(130) having terminals(132) corresponding to the bonding pads are prepared. The bonding pads and the terminals are aligned to mount the semiconductor chip on the printed circuit board, wherein an inactive surface of the semiconductor chip having the side of the active surface in common is mounted on the printed circuit board. The bonding pads and the terminals corresponding to each other are interconnected by an electrical conductive material. The active surface, the bonding pad and the terminal are sealed. |
