Soldering machine

摘要

A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board (12) and electronic parts (14) to be mounted thereon, and which can solder the electronic parts (14) without thermally damaging them. A porous member (130) having a number of holes formed therein is disposed between a blower fan (122) and a heater (140) for making uniform the pressure of a fluid. A radiation plate (150) is disposed between the heater (140) and a heating target (10) for blowing the fluid having been heated by the heater (140) to the heating target (10) in the form of a turbulent flow. The heated fluid is blown to the heating target (10) for heating the same, whereby solder is melted. <IMAGE>