发明名称 MOS-Transistor und Verfahren zu dessen Herstellung
摘要 According to the invention, a recess (V) is interposed between a first source/drain region (S/D1) and a second source/drain region (S/D2) that reach down to a first depth (T1), said recess reaching deeper than the first depth (T1). The recess (V) is provided with a gate dielectric (GD). A gate electrode (GA) is disposed in the recess (V) and extends from the bottom of said recess (V) down to the first depth (T1). An insulating structure (I) is disposed on said gate electrode (GA) and spaces a contact (K) to the gate electrode (GA) in the recess (V) apart from the source/drain regions (S/D1, S/D2). Said source/drain regions (S/D1, S/D2) can be subdivided into highly doped regions (H1, H2) and lightly doped regions (N1, N2). In order to produce self-adjusting source/drain regions (S/D1, S/D2) with respect to the gate electrode (GA) at least parts of the source/drain regions (S/D1, S/D2) are produced by oblique implantation after the gate electrode (GA) has been produced and before the insulating structure (I) and the contact (K) are produced.
申请公布号 DE19957303(A1) 申请公布日期 2001.06.07
申请号 DE19991057303 申请日期 1999.11.29
申请人 INFINEON TECHNOLOGIES AG 发明人 LANDGRAF, ERHARD;HOFMANN, FRANZ
分类号 H01L21/265;H01L21/336;H01L29/78;(IPC1-7):H01L29/78 主分类号 H01L21/265
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