| 摘要 |
A raw compound multilayer body (13) with metallic foils (11,12) is prepared. The metallic foils are set to cover both main surfaces of a raw laminate structure (10) consisting of laminated ceramic green sheets (5). The multilayer body is baked at a temperature lower than the melting point of metallic foil while restraining the contraction of green sheets in the direction of main surface by the foils. The ceramic green sheets are provided with electric conducting pastes (7) so that internal wiring conductors (8,9) may be formed. The outer-conductor films (3,4) are formed by performing the etching process of the metallic foil and performing a patterning based on a photolithography technique after baking. |
