发明名称 Wire-sawing machine
摘要 An ingot 9 is sliced to wafers by a wire 5 which travels around grooved rollers 1 to 3. A tension applied to the wire 5 is detected by tension sensors 21, while vertical displacement of dancer rollers 19 is detected by position sensors 20. At least one of a fluctuation gap of the tension, a fluctuating velocity of the tension, an acceleration of the fluctuation, vertical movement of the dancer rollers 19, a velocity of the vertical movement and acceleration of the vertical movement is calculated from the detection results, and compared with a threshold in a calculating circuit 23 to judge a sign predicting abnormal increase of the tension. When the predicting signal appears, a command signal is outputted from the calculating circuit 22 to a controller 23 to stop operation of a wire-sawing machine or to relax the wire 5. Since rupture of the wire 5 is prevented in bud, a wire-sawing machine is efficiently driven for slicing the ingot 9 with a high productivity.
申请公布号 US6237585(B1) 申请公布日期 2001.05.29
申请号 US20000488906 申请日期 2000.01.21
申请人 SUPER SILICON CRYSTAL RESEARCH INSTITUTE CORP.;TOKYO SEIMITBU CO., LTD. 发明人 OISHI HIROSHI;ASAKAWA KEIICHIRO;MATSUZAKI JUNICHI
分类号 B24B27/06;B23D57/00;B28D5/04;H01L21/304;(IPC1-7):B28D1/06 主分类号 B24B27/06
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