| 发明名称 |
Communication pad structure for semiconductor devices |
| 摘要 |
A bonding pad for a semiconductor device is provided with a mechanical supportive structure substantially surrounding the pad. The mechanical supportive structure prevents cracking of passivation material over the pad when a lead is compression bonded to the pad.
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| 申请公布号 |
US6239703(B1) |
申请公布日期 |
2001.05.29 |
| 申请号 |
US19990300968 |
申请日期 |
1999.04.28 |
| 申请人 |
INTERMEC IP CORP |
发明人 |
FRIEDMAN DANIEL J.;MOSKOWITZ PAUL A.;BRADY MICHAEL J.;DUAN DAH-WEIH;HEINRICH HARLEY K. |
| 分类号 |
H01L23/485;(IPC1-7):G08B13/41 |
主分类号 |
H01L23/485 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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