发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To realize mounting of a capacitance element which relaxes the concentration of electric field, after a nitride film which is used as an insulation film of capacitor is deposited, by controlling the polysilicon surface condition to reduce the degree of projection of polysilicon. SOLUTION: When doping an impurity to a polysilicon film formed on an oxide film for element isolation, a sheet resistance value of the polysilicon film is adjusted by adjusting the doping time to control roughness of the polysilicon film surface. The surface roughness can be set to 20 nm or less, and a lower sheet resistance may be assured to manufacture a highly reliable and highly accurate capacitance element, by setting the impurity doping time to 30 minutes or less.
申请公布号 JP2001144258(A) 申请公布日期 2001.05.25
申请号 JP19990325558 申请日期 1999.11.16
申请人 MATSUSHITA ELECTRONICS INDUSTRY CORP 发明人 JIN YASUSHI
分类号 H01L27/04;H01L21/822;H01L21/8234;H01L21/8249;H01L27/06;(IPC1-7):H01L27/04;H01L21/824 主分类号 H01L27/04
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