| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide mounting method for a semiconductor chip, which can improve connection reliability and can simplify process of manufacture. SOLUTION: In this mounting method of a semiconductor chip, conductive patterns 4 are installed on the upper parts of projections 2, a circuit board 3 is formed, electrode parts 6 on the surface of a semiconductor chip 5 are arranged opposite in the conductive patterns 4 on the upper end parts of the projections 2 in the circuit board 3 and they are electrically connected in an insulating substrate, where the projections 2 are erected through integral formation. The projections 2 are deformed elastically by pressurized force at mounting, and they are heated in a state where they are pressurized. A thermosetting resin 20 arranged between the insulating substrate 1 and the semiconductor chip 5 is cured and the insulating substrate 1, and the semiconductor chip 5 are fixed. Thus, the conductive patterns 4 at the upper parts of the projections 2 in the insulating substrate 1, and the electrode parts 6 on the surface of the semiconductor chip 5 are connected electrically.</p> |
