| 摘要 |
PROBLEM TO BE SOLVED: To prevent the corrosion of a driving means located in a second space. SOLUTION: This device is provided with a treatment space 30 for executing heat treatment, soaking ring 40 for holding a wafer W in the treatment space 30, mechanism part 61 for rotating the soaking ring 40, mechanism part space 60, where the mechanism part 61 is located, gas introducing part 20 for feeding a treatment gas into the treatment space 30, discharge port 80 for discharging the treatment gas in the treatment space 30 from a communicating part 90 for communicating with the treatment space 30 and the mechanism part space 60, and susceptor 45 for linking the soaking ring 40 and the mechanism part 61 in the communicating part 90, temporarily branching the duct of the treatment gas to flow from the treatment space 30 to the discharging port 80 to an inner peripheral duct 90b and an outer peripheral duct 90a in the communicating part 90, making the treatment gas, which flows to the inner peripheral duct 90b, join the treatment gas, which flows to the outer peripheral duct 90a and guiding the gas to the discharging port 80.
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