发明名称 |
Linear CMP tool design using in-situ slurry distribution and concurrent pad conditioning |
摘要 |
An apparatus for multiple component slurry distribution during semiconductor wafer polishing operations. Concurrent polishing pad conditioning is obtained by means of a novel polishing pad design where polishing pads are mounted in a cylindrical configuration as opposed to the conventional flat surface configuration. A polishing pad conditioner is provided to refurbish the polishing pad.
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申请公布号 |
US6235635(B1) |
申请公布日期 |
2001.05.22 |
申请号 |
US19980195654 |
申请日期 |
1998.11.19 |
申请人 |
CHARTERED SEMICONDUCTOR MANUFACTURING LTD. |
发明人 |
ROY SUDIPTO RANENDRA |
分类号 |
B24B37/04;B24B53/007;B24B57/02;B24D13/12;H01L21/304;(IPC1-7):H01L21/302 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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