SOLDERING RESIST COMPOSITION AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To obtain a soldering resist composition which is easily applied with a roll coater and hardly causes the migration of lead and a printed wiring board using the soldering resist composition. SOLUTION: The soldering resist composition contains the acrylate of a novolak type epoxy resin and an imidazole curing agent and has a viscosity adjusted to 0.5-10 Pas at 25 deg.C with a glycol ether solvent.