发明名称 |
Reworking of a ball grid array module |
摘要 |
A method for reworking a Ball Grid Array electronic module by removing the solder balls from the substrate surface after one or more of the connections have been detected to be damaged. The module is immersed in a water soluble oil bath and heated to the melting point. Then a rotating brush, with the rotating axis perpendicular to the substrate plane, removes the solder balls and the solder material particles while the module is still immersed in the fluid.
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申请公布号 |
US6227434(B1) |
申请公布日期 |
2001.05.08 |
申请号 |
US19990273788 |
申请日期 |
1999.03.22 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BASSI LUIGI;MONOPOLI MICHELE;SPINZI PAOLO;VILLA DANILO |
分类号 |
B23K1/018;H05K3/34;(IPC1-7):B23K31/10 |
主分类号 |
B23K1/018 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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