发明名称 |
Organic pin grid array flip chip carrier package |
摘要 |
An organic carrier member for mounting a semiconductor device is provided that has a plurality of pin leads joined to conductive pads on the carrier member by a solder fillet having a reflow temperature higher than the temperature necessary to attach the semiconductor device. Embodiments include a bismaleimide-triazine epoxy laminate carrier member having an array of pins joined to the carrier member by a solder fillet having a reflow temperature of no greater than 275° C.
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申请公布号 |
US6229207(B1) |
申请公布日期 |
2001.05.08 |
申请号 |
US20000482095 |
申请日期 |
2000.01.13 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
MASTER RAJ N. |
分类号 |
H01L23/498;H05K3/34;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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